Hypertec HYMAC57256 (Legacy) memory module 0.25 GB 1 x 0.25 GB SDR SDRAM 133 MHz

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Description

Hypertec HYMAC57256 (Legacy) memory module 0.25 GB 1 x 0.25 GB SDR SDRAM 133 MHzA Hypertec Legacy Memory Module is a module that uses no current DRAM technology and is no longer in mainstream production by OEMS and or third party suppliers. Hypertec are committed to providing a full memory upgrade landscape as part of our core product offering and as such, there may be occasions where we need to utilise professionally repurposed components. Any repurposed components are removed within a full ESD environment and then used to

Memory Buffered memory type Registered (buffered) Internal memory 8 GB Component for PC/server Memory form factor 240-pin DIMM Memory channels Dual-channel ECC Yes Memory clock speed 1333 MHz Internal memory type DDR3 Features Buffered memory type Registered (buffered) Internal memory 8 GB Component for PC/server Memory form factor 240-pin DIMM Memory channels Dual-channel ECC Yes Memory clock speed 1333 MHz Internal memory type DDR3

Load-Reduced ECC DDR4 SDRAM - LRDIMM 288-pin 2400 MHz ( PC4-19200 ) from Hypertec NOTE: This memory meets the memory specification requirements for reliable operation within a HP Generation 8 (or 9)

2 V Memory ranking 2 ECC Yes Memory clock speed 2933 MHz Internal memory type DDR4 Features Buffered memory type Registered (buffered) Backlight No Memory layout (modules x size) 1 x 32 GB Internal memory 32 GB Component for Server Memory form factor 288-pin DIMM CAS latency 21 Memory voltage 1

2 V Design Backlight No Technical details Chips organisation 2Rx4 Memory Buffered memory type Registered (buffered) Memory layout (modules x size) 1 x 64 GB Internal memory 64 GB Component for Workstation Memory form factor 288-pin DIMM CAS latency 21 Memory voltage 1

Hypertec SNPTJ1DYC/8G-HY

This cost-effective upgrade is available in 3200MT/s–3600MT/s speeds

2 V Memory ranking 1 ECC Yes Memory clock speed 2400 MHz Internal memory type DDR4 Weight & dimensions Package width 10 mm Package depth 150 mm Package height 55 mm Package weight 30 g Packaging data Package width 10 mm Package depth 150 mm Package height 55 mm Package weight 30 g Other features Chips organisation 1Rx8

2 V Memory Buffered memory type Unregistered (unbuffered) Memory layout (modules x size) 1 x 16 GB Internal memory 16 GB Component for Laptop Memory form factor 260-pin SO-DIMM CAS latency 17 Memory voltage 1

Memory Memory layout (modules x size) 1 x 2 GB Internal memory 2 GB Component for Laptop Memory form factor 204-pin SO-DIMM Memory clock speed 1600 MHz Internal memory type DDR3 Features Memory layout (modules x size) 1 x 2 GB Internal memory 2 GB Component for Laptop Memory form factor 204-pin SO-DIMM Memory clock speed 1600 MHz Internal memory type DDR3

2 V Memory ranking 2 ECC Yes Memory clock speed 3200 MHz Internal memory type DDR4 Features Buffered memory type Unregistered (unbuffered) Backlight No Memory layout (modules x size) 1 x 32 GB Internal memory 32 GB Component for Workstation Memory form factor 288-pin DIMM CAS latency 22 Memory voltage 1

35 V Memory Buffered memory type Registered (buffered) Internal memory 8 GB Memory form factor 240-pin DIMM Memory voltage 1

and professional workloads

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